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An innovative new application of copper is its extensive use in computer chips. IBM has developed a new semiconductor
manufacturing process which uses copper instead of aluminum. Copper will allow IBM to shrink electronic circuitry to
smaller dimensions and fit more computer components onto a single chip.
Chip designers have long sought to use copprer because of its high conductivity compared to aluminum. Copper's only
drawback, up until now, was its tendency to diffuse into and damage the chip's silicon layer. IBM's new manufacturing
process employs a barrier material which isolates the chemically vapour-deposited copper from the silicon.
The photograph at left (courtesy of IBM) shows a highly magnified Scanning Electron Microscope (SEM) view of IBM's
first-to-market six level copper interconnect technology.
For more information about copper in computer chips, visit IBM's homepage: http://www.ibm.com
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